As Macworld approaches (just 7 days to go!) the rumour mill begins spinning faster and faster. AppleInsider has a report (*ahem* rumour *ahem*) that Apple is set to release new Magnesium-Aluminium iMacs early next year. 

“A new family of iMacs due early next year may include a more sophisticated cooling system, hints the latest reports from sources close to the company’s Taiwanese manufacturing facilities.” reports Slash Lane for AppleInsider. 

AI’s report is based on Chinese paper Economic Daily News’ report, which claims that Foxconn has secured a contract with Apple to manufacture the new chassis. Foxconn will also manufacture the ‘cooling module’, says the paper. 

DigiTimes, another publication situated near Apple’s manufacturing facilities, recently cited sources who said Apple and rival PC makers HP, Acer and Dell had each agreed to use a new family of quad-core desktop chips from Intel in systems due early in 2009. These are low-power desktop chips operating at 65W compared to the 55W of the current iMacs’ mobile processors. Therefore, a decision by Apple to employ the chips inside the iMac line could signal a need for modifications to the computer’s cooling methods.

This move will definitely help bring in Quad-Core processors in a big way for Apple’s consumer desktop. They could built in sophisticated graphics and power, ready and waiting for when Snow Leopard comes trotting along with its Multi-Core “Grand Central” optimisations and features. So are we excited about Macworld or not!

[Full report at AppleInsider]